The Application of the Pin-in-Paste Reflow Process
The Pin-in-Paste (PIP) reflow process, also called through-hole (TH) reflow or pin-in-hole (PIH) reflow technology, has become more popular because it eliminates time-consuming processes, such as hand and traditional wave soldering, without losing the advantages that through hole components can offer.
The benefits of the pin-in-paste reflow process include:
The pin-in-paste reflow process is similar to the SMT reflow process in the following way: Printing solder paste around the through holes first, inserting component pins to relative PCB holes and then sending it to the reflow oven to cook. But, in reality, the pin-in-paste reflow process is not as simple as the regular SMT process. A process engineer needs to evaluate the TH components’ ability in the following way:
Use of the same SMT equipment for both SMT and TH components
Elimination of hand and wave soldering processes
Reduction of machine setup time
Reduction of production turn around space and time
Elimination of the board cleaning process since it is unnecessary to clean TH components
Finally, you should perform experiments as part of the evaluation process.
Are the components PIP ready?
Not all TH components, especially the connector’s plastic housing, can withstand reflow temperatures up to 260°C over several seconds. The component’s geometry such as pin length and free space also need to be reviewed in order to make the right decision.
Is the layout designed for the PIP process?
If the PCB hole diameter is too big, it will require too much solder to fill it up. If it is too small, it is very difficult to fill the hole properly with paste during solder paste printing. Also, low solder volume can cause solder defects.
Is the stencil designed for the PIP process?
To get enough paste to fill up the pin hole, the stencil aperture must be designed bigger than the solder pad size depending upon the paste volume calculation.
Is reflow profile optimized for the PIP process?
Consider a delta type reflow profile first in order to reduce most of the defects. This profile has a slow ramp up of 0.5 to 1°C per second, a slight dwell at the liquidus temperature, a minimum time above liquidus, and a rapid ramp down of 4° C per second or less.
Flason Electronic Co.,ltd provide a full smt assembly line solutions, including SMT reflow oven, wave soldering machine, pick and place machine, solder paste printer, PCB loader, PCB unloader, chip mounter, SMT AOI machine, SMT SPI machine, SMT X-Ray machine, SMT assembly line equipment, PCB production Equipment smt spare parts etc any kind SMT machines you may need, please contact us for more information: wechat whatsapp:008613691605420, Skype: flasonsmt, Email: firstname.lastname@example.org
1) This is the first time I use this kind of machine, is it easy to operate?
There is English manual or guide video that show you how to use machine.
If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.
2) If machine have any problem after I receive it, how can I do ?
Free parts send to you in machine warranty period.
If the part is less than 0.5KG, we pay the postage.
If it exceeds 0.5KG, you need to pay the postage.
3) MOQ ?
1 set machine, mixed order is also welcomed.
4) How can I buy this machine from you? ( Very easy and flexible !)
A. Consult us about this product on line or by e-mail.
B. Negotiate and confirm the final price , shipping , payment methods and other terms.
C. Send you the proforma invoice and confirm your order.
D. Make the payment according to the method put on proforma invoice.
E. We prepare for your order in terms of the proforma invoice after confirming your full payment.
And 100% quality check before shipping.
F.Send your order by air or by sea.
5)Why choose us ?
A. Gold supplier on Alibaba !
B. Trade assurance to US$54,000 !
C. Best price & Best shipping & Best service !