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Mixed process of SMT reflow oven

Shenzhen Flason Electronic Co., Ltd. has established long-term cooperative relations with a number of enterprises by good credit and excellent service. Here share the following three mixed process of SMT reflow oven with you:

A.Reflow one-side mixed technology:

Incoming material inspection => PCB A surface screen printing solder paste (SMT adhesive) => patch => drying (curing) => reflow soldering => Cleaning => Plugins => Wave => Cleaning => test = > Rework 

B, Reflow double-sided mixed technology:

1, incoming material inspection => PCB A screen printing solder paste => patch => dry => reflow soldering => plug-in, pin bent => flap => PCB B pasta plastic patch => patch => curing => flap => Wave => Cleaning => test => repair; A side mix ,B surface mount.

2, incoming material inspection => PCB B pastry plastic patch => patch => cure => flap => PCB A surface plug => Wave => Cleaning => test => Rework; first posted plug, suitable for SMD components rather than the case of separating element

3, incoming material inspection => PCB B pastry plastic patch => patch => cure => flap => PCB A screen printing solder paste => patch => A side reflow => Plugins => B surface wave soldering => Cleaning => test => Rework; A side mix B surface mount. First posted on both sides of SMD, reflow soldering, after the cartridge, wave soldering; A surface mount, B side mix.

4, incoming inspection => plug (pin bent) => flap => PCB PCB A side B side point plastic patch => patch => cure => flap => Wave => Cleaning => test => rework; plug-paste, apply to the separate components rather than SMD components.

C.SMT peripheral equipment process ------ reflow double-sided mixed technology

1, incoming inspection, PCB A screen printing solder paste (SMT adhesive), patch, drying (curing) A side reflow, cleaning, flap; the B-side of the PCB point plastic patch, patch curing the B plane wave soldering, cleaning, testing, repair); This process is suitable for reflow soldering, in the A side of the PCB B surface wave soldering. In the B-side of the PCB assembly SMD, SOT or SOIC below the pin (28), should adopt this technology.

2, incoming inspection, PCB A screen printing solder paste (SMT adhesive), patch, drying (curing) A side reflow, cleaning, flap; PCB B surface screen printing solder paste (SMT glue), chip, drying, reflow soldering (best only the B-side, cleaning, inspection, repair); This process is suitable for the sides of the PCB are affixed equipped with larger SMD PLCC.

Shenzhen Flason Electronic Co., Ltd. reflow oven manufacturer,adhere to "quality first, customer first" purpose, to provide customers with state-of-the-art technology, performance, quality, satisfactory qualified products for the corporate philosophy,with high quality products, quality service .Reflow ovens with good quality, reasonable price, long life, simple operation, won the majority of customers praise. We always put quality and service first, integrity, re-promise, innovation, collaboration, steady pace forward!


CONTACT US

Contact: Andrey

Phone: 13691605420

Tel: 0755-85225569

Email: sales@flason-smt.com

Add: Flason Industry park Shajing Town Baoan district shenzhen China 518104