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  • Tokyo Electron Tel batch furnace Deposition Machine TELINDY
Tokyo Electron Tel batch furnace Deposition Machine TELINDY

Tokyo Electron Tel batch furnace Deposition Machine TELINDY

  • Process: Oxide, Anneal, Nitrade, Poly, TEOS, HTO, High-k
  • Process Temp: RT-1100C
  • Wafer Size (mm):300
  • Additional features, Option:N2/LL Gas cleaning Advance platform
  • Product description: Tokyo Electron Tel batch furnace Deposition Machine TELINDY, Process: Oxide, Anneal, Nitrade, Poly, TEOS, HTO, High-k, Process Temp: RT-1100C, Process Temp: RT-1100C, Additional features, Option:N2/LL
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Tokyo Electron Tel batch furnace Deposition Machine TELINDY

Specifications:

TELINDY is an innovative thermal processing system for 300mm wafer which has all the functionality of high-reliable ALPHA-303i and TELFORMURA™ that enables short TAT thermal processing. Newly designed heater and process chamber expands its performance up to 125 wafers in a batch and provides various process applications with overwhelming throughput.

Product Comparison


TELINDY PLUS™

TELFORMULA™

TELINDY PLUS™ IRad™

TELINDY™

ALPHA(α)-303i

ALPHA-8SE

ALPHA-8S

Wafer size (mm)

300

300

300

300

300

100,150,200

150,200

Availability

New, Certified used

Certified used

New

Certified used

Certified used

Certified used

Certified used

Production load max

-125

-50

-125

-125

-100

-150

-150

Cassette stocker

-18

-10

-18

-16

-16

-21

-21

Process

Thermal ALD, LPCVD,
Oxididation/Anneal

Oxide, Anneal, Nitrade,
Poly, TEOS, High-k

Plasma Assisted ALD
SiN, SiO2*

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO, High-k

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO, High-k

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO, High-k

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO

Reactor

Thermal

Thermal

Plasma

Thermal/Plasma

Thermal

Thermal

Thermal

Process temp

RT-1100C

RT-1000C

RT-800C

RT-1100C

RT-1200C

RT-1250C

RT-1250C

Additional features, Option

N2/LL
Gas cleaning

N2/LL
Gas cleaning

N2/LL
Gas cleaning
*RT SiO2

N2/LL
Gas cleaning
Advance platform

N2,/LL, Gas cleaning:
CIF3 for poly

N2,/LL, Gas cleaning:
CIF3 for poly

N2/LL, Gas cleaning:
CIF3 for poly

Keywords:


Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

Flason Electronic Co.,ltd provide a full Silicon Wafer prodocution line solutions, including Scanner Stepper Coat and Develop Dry Etch Asher Furnace RTP Epitaxy CVD PVD Ion Implant Wet Etch CMP Clean and Dry Plating machines and other Simeconductor Production machines you may need, please contact us for more information: wechat whatsapp IMO: 008613691605420, Skype: flasonsmt, Email: sales@flason-smt.com

FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !