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  • Tokyo Electron Tel Water Scrubber system NS300+ HT
Tokyo Electron Tel Water Scrubber system NS300+ HT

Tokyo Electron Tel Water Scrubber system NS300+ HT

  • Process: DIW scrubber
  • Throughput (wph): 500
  • Wafer size (mm) 300
  • Dry method: Spin, N2 blower
  • Product description: Tokyo Electron Tel Water Scrubber system NS300+ HT to origin Coater/Developer platform, Process: DIW scrubber, Throughput (wph): 500, Wafer size (mm) 300, Dry method: Spin, N2 blower
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Tokyo Electron Tel Water Scrubber system NS300+ HT

Specifications:

The high reliable D.I. Water Scrubber system to origin Coater/Developer platform
The NS300 series is the high productivity scrubber system for 300mm wafer process based on TEL’s industry-leading Coater/Developer platform providing excellent reliability and stability. The system normally has D.I. Water brush clean and originally designed Atomized Spray(AS), bevel brush is also capable to enhance its performance efficiently. Today, in response to further device scaling and transition toward 3D-structure of semiconductor, NS300 series provides tool design flexibility for surface clean to meet process challenges ahead.
The superior reliability and stability of the NS300+ concept has been carried on into the new NS300+ HT. It is an improved, and more productive scrubber. As with the previous system, it is equipped with an 8 process spin chamber and achieves a throughput of up to 500 wafers per hour (a more than 150% increase compared with the previous system) with a footprint equivalent to that of the previous system.

Product Comparison:

NS300Z

NS300+ HT

NS300+

NS300

SS4

Wafer size (mm)

300

300

300

300

100,150,200

Availability

New

New

New

Certified used

Certified used

Throughput (wph)

1000

500

320

180

144

Process

DIW scrubber

DIW scrubber

DIW scrubber

DIW scrubber

DIW scrubber

Substrates

Si, Glass

Si, Glass

Si, Glass

Si, Glass

Si, Sic, Sapphire,

LT, LN

Dry method

Spin, N2 blower

Spin, N2 blower

Spin, N2 blower

Spin, N2 blower

SD2(IPA)

Nozzle type

AS2, Brush,

BVL Brush

AS2, Brush,

BVL Brush

AS2, Jet, Brush

AS2, Jet, Brush

AS2, Jet, Brush

Pertical removal performance

>95%

>95%

>95%

>95%

>95%

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

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FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !