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  • Tokyo Electron Tel Wafer Etch System UNITY Me
Tokyo Electron Tel Wafer Etch System UNITY Me

Tokyo Electron Tel Wafer Etch System UNITY Me

  • Process: Ox, SiN, HM, EB, Contact, Via, Trench, SAC, Spacer, DD
  • Number of chambers: 1-4
  • Wafer Size (mm): 100,150,200
  • Safety S2, CE, ROW
  • Product description: Tokyo Electron Tel Wafer Etch System UNITY Me, Process: Ox, SiN, HM, EB, Contact, Via, Trench, SAC, Spacer, DD, Number of chambers: 1-4, Wafer Size (mm): 100,150,200, Safety S2, CE, ROW
  • INQUIRY

Tokyo Electron Tel Wafer Etch System UNITY Me

Specifications:

The long-selling etch system has been receiving a lot of attention from the SiC market
The UNITY Me achieves excellent cost performance for plasma etch process within 200mm wafer, which provides exceptional reliability and productivity. Recent years, the system has a great deal and favorable approval through demonstration of high performance Si/SiC trench etch process for leading-edge power devices manufacturing.
UNITY Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools.

Product comparison

UNITY Me Ox

UNITY Me Si &
UNITY Me SiC

Chamber

SCCM

DRM

UD

Wafer size (mm)

200

100,150,200

100,150,200

Availability

New, Certified used

New, Certified used

Number of chambers

1-4

1-4

Process

Ox, SiN, HM, EB, Contact, Via,
Trench, SAC, Spacer, DD

Trench, EB, TSV

Substrates

Si, glass, SiC, sapphire, LN, LT, AlTic

Si, SiC, Glass

Safety

S2, CE, ROW

S2, CE, ROW

Additional sizes w/wafer holder (mm)

square

75, square

N/A

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

Flason Electronic Co.,ltd provide a full Silicon Wafer prodocution line solutions, including Scanner Stepper Coat and Develop Dry Etch Asher Furnace RTP Epitaxy CVD PVD Ion Implant Wet Etch CMP Clean and Dry Plating machines and other Simeconductor Production machines you may need, please contact us for more information: wechat whatsapp IMO: 008613691605420, Skype: flasonsmt, Email: sales@flason-smt.com

FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !