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  • Tokyo Electron Tel Wafer Bonder/Debonder Synapse V/Synapse Z Plus
Tokyo Electron Tel Wafer Bonder/Debonder Synapse V/Synapse Z Plus

Tokyo Electron Tel Wafer Bonder/Debonder Synapse V/Synapse Z Plus

  • Accuracy: <5% (TTV of glue thicness)
  • Typical Applications: TSV
  • Wafer Size (mm):300
  • Additional features: Up to 3layer of glue
  • Product description: Tokyo Electron Tel Wafer Bonder/Debonder Synapse V/Synapse Z Plus, Accuracy: <5% (TTV of glue thicness), Typical Applications: TSV, Wafer Size (mm):300, Additional features: Up to 3layer of glue

Tokyo Electron Tel Wafer Bonder/Debonder Synapse V/Synapse Z Plus


Support mass production of 3D integration with reliable technology
Synapse series became an industry standard Bonding/DeBonding tools for 300mm wafers, by combining TEL’s leading-edge technologies such as ultra-thin wafer transfer, chemical coating, plasma processing and cleaning developed over the 50 years of history. Synapse series provide advanced solutions for temporary Bonding/DeBonding process in TSV (Through Silicon Via), permanent bonding process for CMOS image sensor and other various types of devices to contribute to high volume manufacturing of 3D integration which becomes even more important and expected to grow.
Synapse V and Synapse Z Plus, these systems are 300mm wafer bonder/debonder system which enable temporary bonding or debonding process efficiently. As the continuation of Moore’s law is becoming more and more challenging, 3D-IC with through-silicon via (TSV) interconnects secure a firm position in the field of advanced semiconductor, attracting attention as a means to improve semiconductor performance. Synapse V is a temporary wafer bonding system, which allows two wafers to be bonded together by using various adhesives. The system consists of material coating, baking, and bonding functions to realize integrated wafer bonding processes in a single tool. Uniquely developed wafer alignment unit and wafer bonding module provide the highest level of Total Thickness Variation (TTV) and bonding accuracy. Synapse Z Plus, equipped with wafer debonding, device and carrier wafer cleaning function, makes it possible to complete complicated wafer debonding process after TSV process with one system. The system has newly developed special function that provides stabilize transfer and safe process operation of ultra-thin wafers less than about 50um thickness.

Product Comparison:

Synapse Si

Synapse V

Synapse Z Plus

Wafer size (mm)








Typical Applications





(Alignment accuracy)

(TTV of glue thicness)

Additional features

High-alignment accuracy,

Up to 3layer of glue

Carrier wafer cleaning capability


Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

Flason Electronic Co.,ltd provide a full Silicon Wafer prodocution line solutions, including Scanner Stepper Coat and Develop Dry Etch Asher Furnace RTP Epitaxy CVD PVD Ion Implant Wet Etch CMP Clean and Dry Plating machines and other Simeconductor Production machines you may need, please contact us for more information: wechat whatsapp IMO: 008613691605420, Skype: flasonsmt, Email: sales@flason-smt.com


1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !