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  • Tokyo Electron Tel Wafer Bonder/Debonder Equipment Synapse Si
Tokyo Electron Tel Wafer Bonder/Debonder Equipment Synapse Si

Tokyo Electron Tel Wafer Bonder/Debonder Equipment Synapse Si

  • Accuracy: 3σ<100nm (Alignment accuracy)
  • Typical Applications: BSI
  • Wafer Size (mm):300
  • Additional features: High-alignment accuracy, High-reliability
  • Product description: Tokyo Electron Tel Wafer Bonder/Debonder Equipment Synapse Si, Accuracy: 3σ<100nm (Alignment accuracy), Typical Applications: BSI, Wafer Size (mm):300, Additional features: High-alignment accuracy, Hi

Tokyo Electron Tel Wafer Bonder/Debonder Equipment Synapse Si


Support mass production of 3D integration with reliable technology
Synapse series became an industry standard Bonding/DeBonding tools for 300mm wafers, by combining TEL’s leading-edge technologies such as ultra-thin wafer transfer, chemical coating, plasma processing and cleaning developed over the 50 years of history. Synapse series provide advanced solutions for temporary Bonding/DeBonding process in TSV (Through Silicon Via), permanent bonding process for CMOS image sensor and other various types of devices to contribute to high volume manufacturing of 3D integration which becomes even more important and expected to grow.

Synapse Si is a successor model of Synapse S, a wafer fusion bonding equipment widely used in 300mm CMOS image sensor mass production lines. Compared to conventional Synapse™ S, alignment accuracy has been improved. In addition, Synapse Si adopts a compact design that halves the footprint, and also realized high throughput at the same time. By extending additional block, productivity per footprint can be further improved. Highly reliable LITHIUS Pro™ Z platform is adopted and realize high user interface. By following the design of cleaning modules and plasma processing modules that have been proven in front-end process, it achieved high mass production reliability as a 300 mm wafer bonding system. Not only as bonding of silicon oxide film wafers but also as Cu hybrid bonding for mass production line. Deployment to various applications besides CMOS image sensors is expected in the future. TEL will contribute to the development and mass production of these new applications.

Product Comparison:

Synapse Si

Synapse V

Synapse Z Plus

Wafer size (mm)








Typical Applications





(Alignment accuracy)

(TTV of glue thicness)

Additional features

High-alignment accuracy,

Up to 3layer of glue

Carrier wafer cleaning capability


Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

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1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !