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  • Tokyo Electron Tel Test System WDF 12DP
Tokyo Electron Tel Test System WDF 12DP

Tokyo Electron Tel Test System WDF 12DP

  • Probing force (kg): 200/300
  • Stage technology: Linear motor
  • Wafer size​ (mm): 200,300,300DF
  • Optical system: ASU/BCU-Ⅱ
  • Product description: Tokyo Electron Tel Test System WDF 12DP Fully Automatic Dicing Frame Prober, Probing force (kg): 200/300, Stage technology: Linear motor, Wafer size​ (mm): 200,300,300DF, Optical system: ASU/BCU-Ⅱ

Tokyo Electron Tel Test System WDF 12DP


Flexible probing system compatible of wafer and dicing frame handling
The WDF™ series is a fully automatic dicing frame prober capable of flexibly probing with standard wafers and devices on a dicing frame. In the semiconductor test market, various product forms such as thin wafers, advanced packages with TSV's, diced wafers, KGD application, strip frame devices require frame probing. The WDF™ series is an innovative probing technology that supports dicing frame transfer with no change kit. It realizes the same test as the wafer prober but with extremely thin wafers, strip frames, and devices after the dicing/singulation process.
WDF™ 12DP + is the latest dicing frame prober with a new system platform concept that can handle and test both 300mm wafers and 300mm dicing frames with no change kit. By using the optional 8 inch conversion kit, it is possible to probe 200mm dicing frames and wafers to meet diverse test needs with minimal replacement parts and conversion time. You can smoothly introduce your existing test processes with the wafer prober operation. Generating known-good-die (KGD) is immediately available by conducting electrical tests after the dicing/singulation process which could not be previously detected until final package test. Furthermore, innovative KGD test method are becoming required because of advanced packages such as WLCSP, Fan-Out wafer level package, panel scale packaging, etc. The WDF™ 12DP + provides multi-die, high accuracy measurements before and after dicing using TEL’s unique alignment algorithm "N-Shot". WDF™ 12DP + has improved ESD capability to avoid to the device and provide improved cleanliness.

N-Shot alignment technique for diced wafer test

Product Comparison:

WDF™ 12DP+

WDF™ 8

Wafer size (mm)




New, Certified used

New, Certified used

Stage technology

Linear motor

Ball screw

XY probing accuracy (μm)



Z probing accuracy (μm)



Probing force (kg)



Optical system



Operation system




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1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !