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  • Tokyo Electron Tel Surface Preparation system ANTARES -Nano
Tokyo Electron Tel Surface Preparation system ANTARES -Nano

Tokyo Electron Tel Surface Preparation system ANTARES -Nano

  • Wafer per batch: Single wafer
  • Spray method: Cryogenic nano-aerosol
  • Wafer size (mm): 300
  • Chemical dispense: Chemical and water free aerosol
  • Product description: Tokyo Electron Tel Surface Preparation system ANTARES -Nano, Wafer per batch: Single wafer, Spray method: Cryogenic nano-aerosol, Wafer size (mm): 300, Chemical dispense: Chemical and water free aero

Tokyo Electron Tel Surface Preparation system ANTARES -Nano


Production proven yield enhancing defect removal using a unique cryogenic inert gas technology
ANTARES is a series of a fully automated, single-wafer, CryoKinetic systems used for processing 200/300mm wafers. Each system uses cryogenic aerosol technology to safely remove nanoscale particles from device surfaces. Unlike conventional wet technologies, this all-dry process reduces defects without damaging the wafer surface, even on metal and low-k films. ANTARES series enables proven yield enhancing defect removal with no corrosion of metals, no watermarks on hydrophobic surfaces, and no wafer charging. The process is suitable for all materials.
In addition to the classic ANTARES that has been used across multiple technology nodes in semiconductor fabs worldwide, TEL offers the new ANTARES – Nano which features a smaller aerosol size for improved removal efficiency in the smallest nanoparticle size range, plus improved capability for cleaning sensitive patterns without damage. Semiconductor manufacturers have advanced their technology through recent generations by introduction of various new materials, a trend which will continue for the foreseeable future. In many cases the materials have sensitivities which limit the applicability of historical wet clean processes for removing contaminants. Metals are easily corroded, hydrophobic films are prone to watermarks, and some materials such as Ge can be attacked by aqueous chemistries. Furthermore, even traditional materials such as Si and SiO2 frequently must be cleaned with near-zero material loss, due to tightened dimensional requirements. Therefore, this ANTARES -Nano presents cleaning methods that are safe for all materials and patterns are increasingly needed.

Performance comparison of ANTARES – Nano with low-etching wet SC1/spray process.

Surface LPD measurements showing 99% particle removal from hydrophobic ULK surface. Wet processing is not suitable for this film due to watermark defects.

k-value measurement showing no difference in k-value between ANTARES™ - Nano processed wafer and control wafer (no process).

Product Comparison:



Wafer size (mm)


200, 300




Wafer per batch

Single wafer

Single wafer

Throughput lilmit (hardware)

Application dependent

Application dependent

Spray method

Cryogenic nano-aerosol

Cryogenic aerosol

Chemical dispense

Chemical and
water free aerosol

Chemical and
water free aerosol


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1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

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