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  • Tokyo Electron Tel Deposition batch furnace TELINDY PLUS
Tokyo Electron Tel Deposition batch furnace TELINDY PLUS

Tokyo Electron Tel Deposition batch furnace TELINDY PLUS

  • Process: Thermal ALD, LPCVD, Oxididation/Anneal
  • Process Temp: RT-1100C
  • Wafer Size (mm):300
  • Additional features, Option:N2/LL Gas cleaning
  • Product description: Tokyo Electron Tel Deposition batch furnace TELINDY PLUS, Process: Thermal ALD, LPCVD, Oxididation/Anneal, Process Temp: RT-1100C, Wafer Size (mm):300, Additional features, Option:N2/LL Gas cleaning
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Tokyo Electron Tel Deposition batch furnace TELINDY PLUS

Specifications:

State of the art 300mm batch furnace with over 4600 systems shipped
TELINDY PLUS is the industry’s premier iso-thermal large batch platform for oxidation, anneal and LPCVD deposition which are at the core of semiconductor manufacturing. TELINDY PLUS incorporates the pinnacle of hot wall reactor technology and enables superb film quality while maintaining the ultimate in process control and run to run stability. Additionally, TELINDY PLUS is designed with all of the essential architectural design features which maximizes wafer throughput per square foot. Since its introduction, TELINDY PLUS has continued to evolve in capability featuring increased wafer batch sizes and expanded process applications for low temperature ALD (Atomic Layer Deposition) and plasma assisted deposition (TELINDY PLUS IRad) required by ever shrinking device structures, thus supporting the leading edge in device manufacturing.
TELINDY PLUS represents the convergence of demonstrated experience and leading edge thermal processing technology. TELINDY PLUS incorporates specialized features originally developed for short TAT (Turn Around Time) on the TELFORMULA minibatch system as well as field proven, high productivity design elements from the previous generation TELINDY™ platform. Process performance and productivity have continued to improve and further expanded to ALD applications. New enhancements include improved maintenance access through architectural optimization to further reduce maintenance down time. Dry gas chamber cleaning and low O2environment loading area control have realized tangible gains in small particle management contributing to yield increases. The highest levels of productivity have been achieved by combining 125 wafer load size with TEL’s FTPS responsive heater capable of rapid heating and cooling coupled with a dual boat system option. TELINDY PLUS applications range from traditional silicon treatments such as diffused oxides and anneals to LPCVD Si (Poly Si, a-Si), SiO2, Si3N4 to leading edge ALD SiO2, Si3N4 and high-k dielectrics as well as radical (non-plasma) oxidation.

Product Comparison


TELINDY PLUS™

TELFORMULA™

TELINDY PLUS™ IRad™

TELINDY™

ALPHA(α)-303i

ALPHA-8SE

ALPHA-8S

Wafer size (mm)

300

300

300

300

300

100,150,200

150,200

Availability

New, Certified used

Certified used

New

Certified used

Certified used

Certified used

Certified used

Production load max

-125

-50

-125

-125

-100

-150

-150

Cassette stocker

-18

-10

-18

-16

-16

-21

-21

Process

Thermal ALD, LPCVD,
Oxididation/Anneal

Oxide, Anneal, Nitrade,
Poly, TEOS, High-k

Plasma Assisted ALD
SiN, SiO2*

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO, High-k

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO, High-k

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO, High-k

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO

Reactor

Thermal

Thermal

Plasma

Thermal/Plasma

Thermal

Thermal

Thermal

Process temp

RT-1100C

RT-1000C

RT-800C

RT-1100C

RT-1200C

RT-1250C

RT-1250C

Additional features, Option

N2/LL
Gas cleaning

N2/LL
Gas cleaning

N2/LL
Gas cleaning
*RT SiO2

N2/LL
Gas cleaning
Advance platform

N2,/LL, Gas cleaning:
CIF3 for poly

N2,/LL, Gas cleaning:
CIF3 for poly

N2/LL, Gas cleaning:
CIF3 for poly

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

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FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !