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Tokyo Electron Tel Batch Furnace single wafer deposition system Triase+ EX-II TiN

Tokyo Electron Tel Batch Furnace single wafer deposition system Triase+ EX-II TiN

  • Application: Capacitor electrode, Word line barrier, Metal gate
  • Process: ASFD TiN, TiON
  • Wafer Size (mm):300
  • Substrates:Si
  • Product description: Tokyo Electron Tel Batch Furnace single wafer deposition system Triase+ EX-II TiN, Application: Capacitor electrode, Word line barrier, Metal gate, Process: ASFD TiN, TiON, Wafer Size (mm):300, Substr
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Tokyo Electron Tel Batch Furnace single wafer deposition system Triase+ EX-II TiN

Specifications:

Designed to deliver optimal solutions for a wide range of challenging thin film depositions.
The Triase+™ series offers extra value as the latest single wafer deposition system, by allowing direct incorporation of various 300mm processing modules. The Triase+™ series predominately or primarily provides high precision metal deposition process such as Ti, TiN and W for plug and electrode formation with excellent tool reliability. In addition to the metals, Triase+™ SPAi for low temperature plasma processing system provides a wide range of critical FEOL applications. The Triase+™ series has been applied over the years with an extensive product lineup to suit each and every customer production requirements.
Semiconductor process technology has been continually scaling down and moving toward 3D structures, that present challenges in the film deposition. The Triase+™ EX-II™ TiN (Titanium Nitride) is an advanced 300mm single wafer deposition system for high speed ASFD1 which enables high-quality thin film formation with excellent within-wafer uniformity and high step coverage characteristics. Featuring an optimized reactor design with new gas injection module, the system achieves high productivity even in the leading-edge semiconductor device manufacturing, and is used for various applications including formation of contact barriers, capacitor electrodes, word line barriers and metal gates. The Triase+™ EX-II™ TiN Plus provides excellent uniformity for conformal metal deposition of TiN on complex structures. Also, two of the latest models have been added to the line-up. The Triase+™ EX-II™ TiN Plus HT specializes in high-temperature TiN deposition that is aimed to gain lower contact resistance film with reducing impurity levels, whereas the Triase+™ EX-II™ TiON (Titanium OxyNitride) provides low leakage current TiON film deposition with can be used in MIM capacitor2 electrode formation. All these models have flexible design, up to four chambers can be integrated and individual chamber has optimized clean technology to achieve high productivity and low CoC.


TiN film Chlorine content


TiN film resistivity reduction

EX-Ⅱ™ TiN Plus HT coverage

1 ASFD: Advanced Sequential Flow Deposition. A low-temperature processing method for forming nanoscale metal films with highly-engineered properties
2 MIM capacitor: Metal-Insulator-Metal capacitor. It consists of two metal layers with an insulator layer in between

Product Comparison:

Triase+ EX-Ⅱ TiN

Triase+ Ti/TiN

Triase+ W

Triase+ SPAi

Wafer size (mm)

300

300

300

300

Availability

Certified used

Certified used

Certified used

Certified used

Application

Capacitor electrode, Word line barrier,
Metal gate

Contact,
Capacitor electrode

Contact plug,

Via Fill

Gate nitridation,
Gate recovery oxidation,
STI liner oxidation,
High-k nitridation

Process

ASFD TiN, TiON

CVD Ti/TiN

W

Oxidation, Nitridation

Substrates

Si

Si

Si

Si

Additional features

High step coverage,
Good TiN film property, High speed deposition, Cycle time,
ClF3 cleaning

High step coverage,
Simultaneous TiSi, Formation during Ti deposition,
ClF3 cleaning

High productivity,
ClF3 cleanining

Low tempreture and damageless plasma process, High density and low electron tempreture plasma

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

Flason Electronic Co.,ltd provide a full Silicon Wafer prodocution line solutions, including Scanner Stepper Coat and Develop Dry Etch Asher Furnace RTP Epitaxy CVD PVD Ion Implant Wet Etch CMP Clean and Dry Plating machines and other Simeconductor Production machines you may need, please contact us for more information: wechat whatsapp IMO: 008613691605420, Skype: flasonsmt, Email: sales@flason-smt.com

FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !