Home > Wafer Fabricaton

  • Nikon Steppers NES1W-i04 for MEMS, LEDs, and Packaging Markets
Nikon Steppers NES1W-i04 for MEMS, LEDs, and Packaging Markets

Nikon Steppers NES1W-i04 for MEMS, LEDs, and Packaging Markets

  • Wavelength (nm):365
  • Throughput:150
  • Wafer Size (mm):150
  • Product description: Nikon Steppers NES1W-i04 for MEMS, LEDs, and Packaging Markets, Wavelength (nm):365, Throughput:150, Wafer Size (mm):150
  • INQUIRY

Nikon Steppers NES1W-i04 for MEMS, LEDs, and Packaging Markets

Specifications:

Key Benefits
Deliver i-line capabilities with resolution ≤ 1 µm
Deliver excellent overlay performance
Support backside alignment to 0.8 µm
Provides optimal productivity and fab efficiency


Deliver i-line capabilities with resolution ≤ 1 µm
Nikon recognizes that i-line requirements are becoming increasingly prevalent, and NES1W-i04 steppers accommodate i-line resist processing and deliver resolution capabilities below 1 µm, with champion data down to 0.8 µm demonstrated. These MEMS steppers utilize a 0.12 to 0.24 variable numerical aperture projection lens design with 2.5x reduction that was developed to address the unique process challenges presented by these specialized i-line applications. The NES1W-i04 enables up to 6 µm depth of focus, and its advanced autofocus system provides die-by-die autofocus capabilities that further increase yield for these challenging processes. NES1W-i04 systems fully satisfy the diverse and ever-changing requirements for MEMS i-line research and development applications.

Deliver excellent overlay performance
Problematic effects such as wafer deformation and process-induced shrinkage can be challenging for some applications; however, the NES1W-i04 employs enhanced global alignment (EGA) to optimize overlay accuracy to 0.30 µm for the 15 mm field. EGA functions by utilizing multiple alignment marks across the wafer to ensure best fit alignment and thereby compensate for rotation issues or process-induced deformations. Pattern Matching Alignment capabilities are also available to provide increased flexibility for reticle design.

Support backside alignment to 0.8 µm
Customers may also choose to add on backside alignment functionality to enable precise alignment of 0.8 µm and below to marks located on the backside of the wafer surface. The industry-leading backside alignment system incorporates both direct and infra-red alignment capabilities to optimize performance.

Provides optimal productivity and fab efficiency
NES1W-i04 steppers can process up to 62 150 mm wafers per hour, and the substrate handling system employs a newly developed edge grip design that works well with TAIKO® and other thin wafers, and the verneuil chuck can utilize non-contact delivery as well as traditional handling. The chuck design also enables dual-sided non-contact exposure.

In addition, NES1W-i04 steppers reduce reticle costs with the Dual Exposure Area for a Single Reticle function, which makes it possible to utilize two separate exposure patterns on a single reticle by rotating the reticle according to programmable settings. Reticle blinds are then used to control the actual exposure area. In addition to delivering productivity benefits to ensure low cost of ownership for manufacturers, these stepper also minimize total fab costs with compact footprints, and satisfy global safety compliance specifications.

Basic Specifications:


· Wavelength (nm)

· Lens-NA

· Exposure Area (mm)

· Reduction Ratio

· Resolution (µm)

· Depth of Focus (µm)

· Overlay Accuracy (µm)

· Throughput

· Wafer Size (mm)

· 365

· 0.12 – 0.24 variable

· 15 mm square

· 1/2.5

· 1.0

· 6.0

· 0.30

· 150 mm: 62 WPH

· ≤ 150

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

Flason Electronic Co.,ltd provide a full Silicon Wafer prodocution line solutions, including Scanner Stepper Coat and Develop Dry Etch Asher Furnace RTP Epitaxy CVD PVD Ion Implant Wet Etch CMP Clean and Dry Plating machines and other Simeconductor Production machines you may need, please contact us for more information: wechat whatsapp IMO: 008613691605420, Skype: flasonsmt, Email: sales@flason-smt.com

FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !