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  • Nikon MEMS Steppers NES2W-i10
Nikon MEMS Steppers NES2W-i10

Nikon MEMS Steppers NES2W-i10

  • Wavelength (nm):365
  • Throughput: 150 mm - 120 WPH 200mm - 71 WPH
  • Wafer Size (mm):150-200
  • Product description: Nikon MEMS Steppers NES2W-i10 for MEMS, LEDs, and Packaging Markets, Wavelength (nm):365, Throughput: 150 mm - 120 WPH 200mm - 71 WPH, Wafer Size (mm):150-200
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Nikon MEMS Steppers NES2W-i10 for MEMS, LEDs, and Packaging Markets

Specifications:

Key Benefits
Maximize productivity with large 44 mm field size and throughput over 70 WPH
Accommodate the most challenging process requirements with 74 µm depth of focus
Deliver i-line capabilities with resolution ≤ 3.7 µm
Provide excellent overlay performance for large field
Support backside alignment to 0.8 µm


Maximize productivity with large 44 mm field size and throughput beyond 100 WPH
The NES2W-i10 makes use of advanced lens technology to enable a large 44 x 44 mm field size to boost productivity, while at the same time delivering tremendous depth of focus. The handling system employs a newly developed edge grip design that works well with TAIKO® and other thin wafers, and the verneuil chuck can utilize non-contact delivery as well as traditional handling. The chuck design also enables dual-sided non-contact exposure. The NES2W-i10 can process over 70 200 mm wafers per hour.

Accommodate the most challenging process requirements with 74 µm depth of focus
NES2W-i10 systems are 1x steppers that utilize a newly developed projection lens with a 0.07 numerical aperture to deliver depth of focus up to 74 µm and beyond. In addition, their advanced autofocus systems provide die-by-die autofocus capabilities that further increase yield for these difficult processes, providing a superior alternative to mask aligners that have historically been used.

Deliver i-line capabilities with resolution ≤ 3.7 µm
Nikon recognizes that i-line applications are becoming increasingly prevalent, and the latest generation MEMS Steppers accommodate i-line resist processing and deliver resolution capabilities ≤ 3.7 µm, with champion data down to 2.6 µm. The NES2W-i10 systems fully satisfy the diverse and ever-changing requirements for discrete, power and analog device processing.

Provide excellent overlay performance for large field
Problematic effects such as wafer deformation and process-induced shrinkage can be challenging for some applications; however, the NES2W-i10 employs enhanced global alignment (EGA) to optimize overlay accuracy to 0.60 µm for the large 44 mm field. EGA functions by utilizing multiple alignment marks across the wafer to ensure best fit alignment and thereby compensate for rotation issues or process-induced deformations. Pattern Matching Alignment capabilities are also available to provide increased flexibility for reticle design. The NES2W-i10 can easily replace mask aligners, delivering enhanced overlay with optimal yield.

Support backside alignment to 0.8 µm
Customers may also choose to add on backside alignment functionality to enable precise alignment of 0.8 µm and below to marks located on the backside of the wafer surface. The newly developed backside alignment system incorporates both direct and infra-red alignment capabilities to optimize performance.

Basic Specifications:


· Wavelength (nm)

· Lens-NA

· Exposure Area (mm)

· Reduction Ratio

· Resolution (µm)

· Depth of Focus (µm)

· Overlay Accuracy (µm)

· Throughput

· Wafer Size (mm)

· 365

· .07

· 44 mm square

· 1/1

· 3.7

· 74

· 0.6

· 150 mm - 120 WPH 200mm - 71 WPH

· 150 and 200

The NES2W-i10 stepper delivers tremendous depth of focus.

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

Flason Electronic Co.,ltd provide a full Silicon Wafer prodocution line solutions, including Scanner Stepper Coat and Develop Dry Etch Asher Furnace RTP Epitaxy CVD PVD Ion Implant Wet Etch CMP Clean and Dry Plating machines and other Simeconductor Production machines you may need, please contact us for more information: wechat whatsapp IMO: 008613691605420, Skype: flasonsmt, Email: sales@flason-smt.com

FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !