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  • Nikon Dry ArF Laser Scanner Deep UV NSR-S322F
Nikon Dry ArF Laser Scanner Deep UV NSR-S322F

Nikon Dry ArF Laser Scanner Deep UV NSR-S322F

  • Wavelength (nm):193
  • Exposure Area (mm):26 x 33
  • Wafer Size (mm):300
  • Product description: Nikon Dry ArF Laser Scanner Deep UV NSR-S322F,Wavelength (nm):193, Exposure Area (mm):26 x 33, Wafer Size (mm):300
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Nikon Dry ArF Laser Scanner Deep UV NSR-S322F

Specifications:

Deep UV

As design rules for new processes become more challenging, dry ArF and KrF scanners must deliver ultra-high productivity with overlay accuracy comparable to immersion systems, as well as exceptional system stability and matching capabilities. Nikon offers the industry-leading NSR-S322F ArF and NSR-S220D KrF scanners, which utilize the innovative Streamlign platform to deliver world-class performance for critical non-immersion layers. The successful combination of the Stream Alignment and Five-Eye FIA systems enables scanner throughput ≥ 230 wafers per hour. In addition, proven Bird’s Eye Control enables single machine overlay accuracy ≤ 2 nm for the S322F and ≤ 3 nm for the S220D, coupled with outstanding overlay stability. Nikon recognizes chipmakers have diverse production objectives, and also offers the NSR-S210D KrF scanner, which employs established Tandem Stage technology to satisfy less-critical 248 nm requirements with low cost of ownership.
Key Benefits
Delivers world-class dry ArF performance and productivity through Streamlign platform innovations
Enables superior yield with overlay accuracy ≤ 2 nm
Maximizes manufacturing flexibility with mix-and-match overlay ≤ 5 nm
Ensures excellent imaging with 0.92 NA lens and advanced tool control capabilities
Provides optimal affordability with ultra-high throughput ≥ 230 wafers per hour

Delivers world-class dry ArF performance and productivity through Streamlign platform innovations
The semiconductor industry is transitioning to development and high volume manufacturing of next-generation process devices, with the most critical layers exposed using immersion scanners with multiple patterning. In addition, as design rules for new technologies become more challenging, many layers will need to transition from KrF to ArF dry processes. This necessitates dry 193 nm scanners that deliver high productivity with overlay accuracy comparable to immersion systems, as well as exceptional system stability and matching capabilities.

The NSR-S322F is the industry-leading dry ArF scanner for high volume manufacturing. It combines the proven Streamlign platform with continuous technology advancements to satisfy the requirements of the most demanding non-immersion 193 nm layers.

Enables superior yield with overlay accuracy ≤ 2 nm
The NSR-S322F utilizes the proven Bird’s Eye Control system, which uses laser encoders along with conventional interferometers to accurately determine wafer position time after time. This is coupled with enhanced lens distortion and wafer holder thermal management solutions. Together these innovations improve focus control and enable single machine overlay accuracy ≤ 2 nm. With overlay improved by more than 30% compared to the previous generation system, the S322F delivers maximized yield for leading-edge dry ArF applications.

The S322F has demonstrated single machine overlay (SMO) Avg. + 3σ capabilities of x=1.8 and y=1.9 nm across the lot. In addition, Phase Shift Focus Monitor (PSFM) across wafer focus control of 12.0 nm (including edge shots) has been achieved.

Maximizes manufacturing flexibility with mix-and-match overlay ≤ 5 nm
Mix-and-match overlay (MMO) is vital for advanced applications, and compensation functions that adjust the grid and distortion of one scanner to another are essential for heightened matching performance. The S322F supports advanced shot distortion correction capabilities provided by Dynamic Matching Adjustment Control. Correction for k9 trapezoid shape and k17 c-shape distortions across the scan slit, as well as k18 c-shape distortion compensation that allows distortion correction along the scan slit are available. This function successfully mitigates distortion variation, even under high dose conditions, to optimize performance for the most demanding mix-and-match requirements. The NSR-S322F enhances scanner matching capabilities and production flexibility, delivering mix-and-match overlay performance below 5 nm.

Mix-and-match overlay between immersion and dry scanners is of particular importance. MMO data collected using the NSR-S630D immersion scanner for the first print, and the S322F for the second print showed lot MMO Avg. + 3σ performance below 3.5 nm.

Ensures excellent imaging with 0.92 NA lens and advanced tool control capabilities
The S322F features an enhanced 0.92 numerical aperture projection lens to enable resolution of 65 nm or better with optimal CD uniformity. Superior materials and proprietary manufacturing technology provide a virtually perfect lens that is essentially flare free and has the industry’s lowest aberration levels. The S322F delivers lower lens distortion and employs the iMAC lens controller to provide sophisticated lens tuning capability. This is coupled with POLANO polarization control, which enhances image contrast without any loss of illumination power or throughput. In addition, the optional Reticle Bending function enables reticle-specific adjustments to compensate for reticle signatures to optimize imaging performance.

The NSR-S322F also enables a number of advanced tool control solutions supported by the Nikon Plug and Play Manager, which further enhance tool stability and on-product performance. The Zeroing Autofocus function performs automated periodic machine calibration that improves scanner stability with machine-specific autofocus corrections. Similarly, the Zeroing XY function can perform automated periodic machine calibrations and machine-specific grid corrections to further enhance overlay stability. In addition, CDU Master makes it possible for the scanner to correct for other process window detractors. It provides high-order dose and focus adjustments to reduce residual CD errors both across the shot and across the wafer.

Provides optimal affordability with ultra-high throughput ≥ 230 wafers per hour
Chipmakers will utilize dry lithography as much as possible to balance multiple patterning costs. Therefore, S322F throughput is a critical factor in making advanced processes cost effective for manufacturing. The NSR-S322F employs sophisticated dry sequencing, and its wafer stage uses optimized scan speed and acceleration capabilities to reduce exposure time. In addition, the Stream Alignment wafer mapping system utilizes multiple alignment microscopes (Five-Eye FIA) and a wide area autofocus sensor (Straight Line Autofocus) that spans the wafer to pre-scan the substrate during loading−dramatically reducing wafer overhead time. Together, these innovations enable throughput ≥ 230 wafers per hour (WPH) using 96 exposures/wafer.

Basic Specifications:


· Wavelength (nm)

· Lens-NA

· Exposure Area (mm)

· Reduction Ratio

· Resolution (nm)

· Single Machine Overlay (nm)

· Mix-and-Match Overlay (nm)

· Throughput:

· 300 mm (96 exp fields)

· Wafer Size (mm)

· 193

· 0.92

· 26 x 33

· 1/4

· ≤ 65

· ≤2

· ≤5

·

· ≥ 230

· 300


Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

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FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

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A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

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And 100% quality check before shipping.

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