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Canon FPA-6300ES6a DUV Scanners

Canon FPA-6300ES6a DUV Scanners

  • Wafer Size:300 mm
  • Field Size: 26 mm x 33 mm
  • Overlay Accuracy ≤ 5 nm* (|m| + 3 σ, Single Tool Overlay)
  • Throughput ≥ 200 wph** (300 mm, 98 shots)
  • Product description: Canon FPA-6300ES6a DUV Scanners, Wafer Size:300 mm, Field Size: 26 mm x 33 mm, Overlay Accuracy ≤ 5 nm* (|m| + 3 σ, Single Tool Overlay), Throughput ≥ 200 wph** (300 mm, 98 shots)
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Canon FPA-6300ES6a DUV Scanners

Specifications:

FPA-6300ES6a
The FPA-6300ES6a KrF single-stage lithography tool is designed for the mass production of Dynamic Random Access Memory (DRAM), flash and other memory devices; logic devices such as microprocessors for personal computers; color filters and other imaging sensors and image-processing devices.
Based on technologies cultivated through the field-proven FPA-6000 series, Canon's new FPA-6300ES6a DUV scanner achieves high throughput and high overlay accuracy to effectively respond to the advanced needs of chip manufacturers seeking reduced cost of ownership.
Features
High-Productivity Scanner: The new Canon DUV scanner incorporates a newly designed reticle stage and wafer stage that significantly reduces wafer handling, alignment and exposure processes times. The FPA-6300ES6a scanner realizes a throughput of more than 200 wafers per hour* when available options are applied.
*12-inch wafers, 98 shots, with Throughput Upgrade applied
High-Accuracy Scanner: The FPA-6300ES6a employs highly sophisticated stage-control technologies, an improved alignment scope and precise temperature and distortion control to make possible an overlay accuracy of 5 nm** when available options are applied. The advanced 0.86NA projection optical system and a wide range of options support demanding and robust device production.
** with Overlay Upgrade applied
High-Reliability Scanner: The FPA-6300ES6a platform provides substantial improvements in terms of base durability and maintenance requirements, as well as reduced install times and increased system uptime and availability***. FPA-6300ES6a options and upgrades further improve overlay accuracy and productivity, offering scalability to support next-generation semiconductor manufacturing.
*** Compared with FPA-6000ES6a scanner

Model Type

KrF (248 nm) DUV Scanner

Wafer Size

300 mm

Resolution

≤ 90 nm

Numerical Aperture (NA)

0.50 ~ 0.86

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio

4:1

Field Size

26 mm x 33 mm

Overlay Accuracy

≤ 5 nm* (|m| + 3 σ, Single Tool Overlay)

* Overlay Upgrade Required

Throughput

≥ 200 wph** (300 mm, 98 shots)

** High-Throughput Upgrade Required

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

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FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

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