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  • Canon FPA-6300ES6a DUV Scanners
Canon FPA-6300ES6a DUV Scanners

Canon FPA-6300ES6a DUV Scanners

  • Wafer Size:300 mm
  • Field Size: 26 mm x 33 mm
  • Overlay Accuracy ≤ 5 nm* (|m| + 3 σ, Single Tool Overlay)
  • Throughput ≥ 200 wph** (300 mm, 98 shots)
  • Product description: Canon FPA-6300ES6a DUV Scanners, Wafer Size:300 mm, Field Size: 26 mm x 33 mm, Overlay Accuracy ≤ 5 nm* (|m| + 3 σ, Single Tool Overlay), Throughput ≥ 200 wph** (300 mm, 98 shots)

Canon FPA-6300ES6a DUV Scanners


The FPA-6300ES6a KrF single-stage lithography tool is designed for the mass production of Dynamic Random Access Memory (DRAM), flash and other memory devices; logic devices such as microprocessors for personal computers; color filters and other imaging sensors and image-processing devices.
Based on technologies cultivated through the field-proven FPA-6000 series, Canon's new FPA-6300ES6a DUV scanner achieves high throughput and high overlay accuracy to effectively respond to the advanced needs of chip manufacturers seeking reduced cost of ownership.
High-Productivity Scanner: The new Canon DUV scanner incorporates a newly designed reticle stage and wafer stage that significantly reduces wafer handling, alignment and exposure processes times. The FPA-6300ES6a scanner realizes a throughput of more than 200 wafers per hour* when available options are applied.
*12-inch wafers, 98 shots, with Throughput Upgrade applied
High-Accuracy Scanner: The FPA-6300ES6a employs highly sophisticated stage-control technologies, an improved alignment scope and precise temperature and distortion control to make possible an overlay accuracy of 5 nm** when available options are applied. The advanced 0.86NA projection optical system and a wide range of options support demanding and robust device production.
** with Overlay Upgrade applied
High-Reliability Scanner: The FPA-6300ES6a platform provides substantial improvements in terms of base durability and maintenance requirements, as well as reduced install times and increased system uptime and availability***. FPA-6300ES6a options and upgrades further improve overlay accuracy and productivity, offering scalability to support next-generation semiconductor manufacturing.
*** Compared with FPA-6000ES6a scanner

Model Type

KrF (248 nm) DUV Scanner

Wafer Size

300 mm


≤ 90 nm

Numerical Aperture (NA)

0.50 ~ 0.86

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio


Field Size

26 mm x 33 mm

Overlay Accuracy

≤ 5 nm* (|m| + 3 σ, Single Tool Overlay)

* Overlay Upgrade Required


≥ 200 wph** (300 mm, 98 shots)

** High-Throughput Upgrade Required


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There is English manual or guide video that show you how to use machine.

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2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

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1 set machine, mixed order is also welcomed.

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