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  • Canon FPA-5550iZ2 Stepper
Canon FPA-5550iZ2 Stepper

Canon FPA-5550iZ2 Stepper

  • Wafer Size:300 mm
  • Field Size:26 mm (max) x 33 mm (max)
  • Overlay Accuracy ≤ 15 nm (|m|+3)
  • Dimension: (W x D x H) 2,300 mm × 3,660 mm × 3,000 mm
  • Product description: Canon FPA-5550iZ2 Stepper, Canon's New high-productivity Mix-and-Match compatible i-line stepper, Wafer Size:300 mm, Field Size:26 mm (max) x 33 mm (max), Overlay Accuracy ≤ 15 nm (|m|+3), Dimension:
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Canon FPA-5550iZ2 Stepper

Specifications:


Features
FPA-5550iZ2 provides high productivity and overlay accuracy.FPA-5550iZ2 steppers reduce wafer processing time by optimizing the alignment, exposure and wafer transfer sequences.
FPA-5550iZ2 steppers shorten lot replacement time and speed up measurement and calibration processing to enable high productivity.
FPA-5550iZ2 steppers are equipped with a Shot Shape Compensator (SSC Unit) to enable shot shape correction of vertical and horizontal magnification differences and skew (shot distortion in diagonal orientation) within each exposure field.
Shot Shape Compensator employs original Canon technology in the projection optical system that allows improved matching to underlying layers and improved overlay accuracy.
FPA-5550iZ2 steppers provide a variety of solutions for logic / memory / image sensor.Productivity improvement and Overlay Improvement options to balance throughput and overlay accuracy are available.
Color filter and other alignment system options established for earlier FPA-5550iZ steppers allow stable operation and flexibility for a variety of processes.
Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.

Model Type

i-Line (365 nm) Stepper

Wafer Size

300 mm

Resolution

≤ 0.35 µm

Numerical Aperture (NA)

0.45 ~ 0.57

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio

4:1

Field Size

26 mm (max) x 33 mm (max)

Overlay Accuracy

SMO1 ≤ 15 nm (|m| + 3σ)

MMO1 ≤ 20 nm (|m| + 3σ)

Footprint (W x D x H)

2,300 mm × 3,660 mm × 3,000 mm

Options

1Overlay Accuracy Improvement Option

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Productivity Improvement Option

Non-linear Overlay Compensation (EAGA-FL)

Low Oxygen Exposure (LOX)

Pellicle Particle Checker

Chemical Filtering

Resist Outgassing Unit

PC Remote Console

Online Functions (GEM)

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

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FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !