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Canon FPA-5520iV / FPA-5520iV HR Option Stepper

Canon FPA-5520iV / FPA-5520iV HR Option Stepper

  • Wafer Size :300 mm, 200 mm
  • Field Size: 52 mm x 34 mm
  • Overlay Accuracy ≤ ≤150 nm (|m| + 3σ)
  • Product description: Canon FPA-5520iV / FPA-5520iV HR Option Stepper, Wafer Size :300 mm, 200 mm, Field Size: 52 mm x 34 mm, Overlay Accuracy ≤ ≤150 nm (|m| + 3σ)
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Canon FPA-5520iV / FPA-5520iV HR Option Stepper

Specifications:

FPA-5520iV / FPA-5520iV HR Option Stepper
Canon’s new FPA-5520iV HR Option i-line stepper for advanced packaging succeeds the FPA-5520iV that was launched in July 2016 and recognized for its high resolution and high overlay accuracy. The new FPA-5520iV HR option lithography tool provides improved functionality and realizes enhanced productivity required for processes such as Fan Out Wafer Level Packaging (FOWLP) to support the realization of higher-integration-levels and thinner-package semiconductor devices with low production

Features
FPA-5520iV HR Option achieves resolution of 0.8μm to support the advanced packaging process •
In response to the growing demand for high-density redistribution layer wiring in the FOWLP market, “FPA-5520iV HR option” has been released since December 2018
The FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8μm, the finest resolution available in packaging-oriented lithography systems*
FPA-5520iV addresses next-generation packaging production challenges including Fan Out Wafer Level Packaging [FOWLP]
FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome
FPA-5520iV steppers employ a wafer handling system with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates
FPA-5520iV stepper wafer stages adopt a new wafer chucking system with increased suction to secure and flatten substrates, allowing high optical performance
FPA-5520iV steppers utilize a new wide-field alignment scope with a field-of-view that is doubled vs. FPA-5510iV steppers, making automatic wafer alignment possible when wafers contain large amounts of die shift, to improve equipment utilization and productivity

FPA-5520iV is a high performance i-line stepper •
FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers**
FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers
FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as 20%***
FPA-5520iV inherits the benefits proven by the FPA-5510iV •
FPA-5520iV steppers inherit the proven high-resolution projection lens of the FPA-5510iV stepper
FPA-5520iV steppers provide the same alignment system options as FPA-5510iV steppers to deliver robust and accurate overlay performance
FPA-5520iV steppers adopt FPA-5510iV stepper console software with common operation procedures and easy recipe conversion
* Among same-class i-line steppers. With flatness equal to Si wafer. As of December 10, 2018. Based on a Canon survey.
** Among same-class i-line steppers. As of July 4, 2016, based on a Canon survey
*** Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose

Model Type

i-Line (365 nm) Stepper

Wafer Size

300 mm

Resolution

FPA-5520iV: ≤ 1µm

FPA-5520iV HR Option: ≤ 0.8µm

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio

2:1

Field Size

52 mm x 34 mm

Overlay Accuracy

≤150 nm (|m| + 3σ)

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

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FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

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