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Canon FPA-5520iV / FPA-5520iV HR Option Stepper

Canon FPA-5520iV / FPA-5520iV HR Option Stepper

  • Wafer Size :300 mm, 200 mm
  • Field Size: 52 mm x 34 mm
  • Overlay Accuracy ≤ ≤150 nm (|m| + 3σ)
  • Product description: Canon FPA-5520iV / FPA-5520iV HR Option Stepper, Wafer Size :300 mm, 200 mm, Field Size: 52 mm x 34 mm, Overlay Accuracy ≤ ≤150 nm (|m| + 3σ)

Canon FPA-5520iV / FPA-5520iV HR Option Stepper


FPA-5520iV / FPA-5520iV HR Option Stepper
Canon’s new FPA-5520iV HR Option i-line stepper for advanced packaging succeeds the FPA-5520iV that was launched in July 2016 and recognized for its high resolution and high overlay accuracy. The new FPA-5520iV HR option lithography tool provides improved functionality and realizes enhanced productivity required for processes such as Fan Out Wafer Level Packaging (FOWLP) to support the realization of higher-integration-levels and thinner-package semiconductor devices with low production

FPA-5520iV HR Option achieves resolution of 0.8μm to support the advanced packaging process •
In response to the growing demand for high-density redistribution layer wiring in the FOWLP market, “FPA-5520iV HR option” has been released since December 2018
The FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8μm, the finest resolution available in packaging-oriented lithography systems*
FPA-5520iV addresses next-generation packaging production challenges including Fan Out Wafer Level Packaging [FOWLP]
FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome
FPA-5520iV steppers employ a wafer handling system with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates
FPA-5520iV stepper wafer stages adopt a new wafer chucking system with increased suction to secure and flatten substrates, allowing high optical performance
FPA-5520iV steppers utilize a new wide-field alignment scope with a field-of-view that is doubled vs. FPA-5510iV steppers, making automatic wafer alignment possible when wafers contain large amounts of die shift, to improve equipment utilization and productivity

FPA-5520iV is a high performance i-line stepper •
FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers**
FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers
FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as 20%***
FPA-5520iV inherits the benefits proven by the FPA-5510iV •
FPA-5520iV steppers inherit the proven high-resolution projection lens of the FPA-5510iV stepper
FPA-5520iV steppers provide the same alignment system options as FPA-5510iV steppers to deliver robust and accurate overlay performance
FPA-5520iV steppers adopt FPA-5510iV stepper console software with common operation procedures and easy recipe conversion
* Among same-class i-line steppers. With flatness equal to Si wafer. As of December 10, 2018. Based on a Canon survey.
** Among same-class i-line steppers. As of July 4, 2016, based on a Canon survey
*** Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose

Model Type

i-Line (365 nm) Stepper

Wafer Size

300 mm


FPA-5520iV: ≤ 1µm

FPA-5520iV HR Option: ≤ 0.8µm

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio


Field Size

52 mm x 34 mm

Overlay Accuracy

≤150 nm (|m| + 3σ)


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