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  • Canon FPA-3030EX6 Stepper
Canon FPA-3030EX6 Stepper

Canon FPA-3030EX6 Stepper

  • Wafer Size :300 mm, 200 mm
  • Field Size 52 mm (max) x 56 mm (max)
  • Overlay Accuracy ≤ 50 nm (|m|+3)
  • Dimension: (W x D x H) 2,300 mm × 3,340 mm × 2,700 mm
  • Product description: Canon FPA-3030EX6 Stepper, Wafer Size :300 mm, 200 mm, Field Size 52 mm (max) x 56 mm (max), Overlay Accuracy ≤ 50 nm (|m|+3), Dimension: (W x D x H) 2,300 mm × 3,340 mm × 2,700 mm
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Canon FPA-3030EX6 Stepper

Specifications:

FPA-3030EX6 Stepper
Canon's new FPA-3030EX6 KrF excimer laser stepper for the age of "Internet of Things" [IoT] devices is designed to support fabrication of analog chips, sensors and communication devices for IoT and power devices. The FPA-3030EX6 inherits the functionality of its predecessor, the FPA-3000EX6 (released in September 1999), while also offering compatibility with special substrates and functions used in the fabrication of a multitude of devices.
Features
FPA-3030EX6 is compatible with a variety of special substrates
FPA-3030EX6 steppers accommodates small-sized substrates with diameters of 200 mm or less
FPA-3030EX6 steppers are capable of handling a variety of substrate thicknesses and materials including silicon, sapphire, silicon carbide and glass
FPA-3030EX6 steppers share the same wafer feeding system as the FPA-3030i5+ i-line stepper (released in June 2012) that has built a proven track record handling special and small-sized substrates
FPA-3030EX6 is a high performance KrF excimer laser stepper
FPA-3030EX6 steppers deliver the highest levels of resolution, overlay accuracy and productivity (throughput) among KrF excimer laser steppers in the same class*
FPA-3030EX6 steppers provide 150 nm imaging resolution, 25 nm overlay accuracy and 121 wafers per hour throughput**
FPA-3030EX6 IS compatible with FPA-3000EX6 reticle and recipes
FPA-3030EX6 steppers can use the same reticles as the FPA-3000EX6, making possible the effective utilization of existing equipment and assets
FPA-3000EX6 stepper recipe files can be imported and applied to the new FPA-3030EX6 steppers, easing process development challenges
* As of July 4, 2016, based on a Canon survey
** 200mm wafer, 60 shots

Model Type

KrF (248 nm) DUV Stepper

Wafer Size

200 mm; 150 mm; 125 mm; 100 mm

Resolution

≤ 150 nm

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio

5:1

Field Size

22 mm x 22 mm

Overlay Accuracy

≤25 nm (|m| + 3σ)

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

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FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

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