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Canon FPA-3030EX6 Stepper
Canon's new FPA-3030EX6 KrF excimer laser stepper for the age of "Internet of Things" [IoT] devices is designed to support fabrication of analog chips, sensors and communication devices for IoT and power devices. The FPA-3030EX6 inherits the functionality of its predecessor, the FPA-3000EX6 (released in September 1999), while also offering compatibility with special substrates and functions used in the fabrication of a multitude of devices.
FPA-3030EX6 is compatible with a variety of special substrates
FPA-3030EX6 steppers accommodates small-sized substrates with diameters of 200 mm or less
FPA-3030EX6 steppers are capable of handling a variety of substrate thicknesses and materials including silicon, sapphire, silicon carbide and glass
FPA-3030EX6 steppers share the same wafer feeding system as the FPA-3030i5+ i-line stepper (released in June 2012) that has built a proven track record handling special and small-sized substrates
FPA-3030EX6 is a high performance KrF excimer laser stepper
FPA-3030EX6 steppers deliver the highest levels of resolution, overlay accuracy and productivity (throughput) among KrF excimer laser steppers in the same class*
FPA-3030EX6 steppers provide 150 nm imaging resolution, 25 nm overlay accuracy and 121 wafers per hour throughput**
FPA-3030EX6 IS compatible with FPA-3000EX6 reticle and recipes
FPA-3030EX6 steppers can use the same reticles as the FPA-3000EX6, making possible the effective utilization of existing equipment and assets
FPA-3000EX6 stepper recipe files can be imported and applied to the new FPA-3030EX6 steppers, easing process development challenges
* As of July 4, 2016, based on a Canon survey
** 200mm wafer, 60 shots
KrF (248 nm) DUV Stepper
200 mm; 150 mm; 125 mm; 100 mm
≤ 150 nm
6 in. (0.25 in. thick)
22 mm x 22 mm
≤25 nm (|m| + 3σ)
Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipment，Anlysis/Measurement equipment，Semiconductor production Common equipment.
Flason Electronic Co.,ltd provide a full Silicon Wafer prodocution line solutions, including Scanner Stepper Coat and Develop Dry Etch Asher Furnace RTP Epitaxy CVD PVD Ion Implant Wet Etch CMP Clean and Dry Plating machines and other Simeconductor Production machines you may need, please contact us for more information: wechat whatsapp IMO: 008613691605420, Skype: flasonsmt, Email: email@example.com
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Free parts send to you in machine warranty period.
If the part is less than 0.5KG, we pay the postage.
If it exceeds 0.5KG, you need to pay the postage.
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