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  • Canon Anelva PVD Equipment for Small-Scale Production  EC7000 Series
Canon Anelva PVD Equipment for Small-Scale Production  EC7000 Series

Canon Anelva PVD Equipment for Small-Scale Production EC7000 Series

  • System configuration: Cluster-type (EC7000 sputtering chamber ×1, EC7001 sputtering chamber ×2) Tray transport method
  • Substrate size: φ200mm maximum
  • Cathode: φ4
  • Operation method: Fully automated (pumping, transport, deposition)
  • Product description: Canon Anelva PVD Equipment for Small-Scale Production EC7000 Series, System configuration: Cluster-type (EC7000 sputtering chamber ×1, EC7001 sputtering chamber ×2) Tray transport method, Cathode: φ4
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Canon Anelva PVD Equipment for Small-Scale Production  EC7000 Series

Specifications:


Equipment for Electronic Device Manufacturing and for R&D
Consolidating our proven experience in vacuum and sputtering technology, the EC7000 is a compact cluster-type PVD equipment suitable for small-scale production.
A variety of optional functions enables you to optimize the system according to your needs.
Applications
Small-scale productionFeatures
Standard equipped with load lock stocker chamber and transfer chamber
(Supports up to two sputtering chambers similar to EB1100)
Fully automated operation (pumping, substrate transfer, deposition process)
Supports up to four φ4" cathodes (three by default)
Simultaneous sputtering (Option)
High temperature substrate heating (up to 800℃) (Option)
Support for various substrate size (≤ φ220mm) and deposition methods (offset self-rotational deposition, static facing deposition) by tray transport
Space saving with unit body design main system
Specifications

System configuration:

Cluster-type (EC7000 sputtering chamber ×1, EC7001 sputtering chamber ×2) Tray transport method

Substrate size:

φ200mm maximum

Cathode:

φ4" cathode ×3 (Option: φ12.5" cathode ×1, φ4" cathode ×4)

Operation method:

Fully automated (pumping, transport, deposition)

Keywords:


Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

Flason Electronic Co.,ltd provide a full Silicon Wafer prodocution line solutions, including Scanner Stepper Coat and Develop Dry Etch Asher Furnace RTP Epitaxy CVD PVD Ion Implant Wet Etch CMP Clean and Dry Plating machines and other Simeconductor Production machines you may need, please contact us for more information: wechat whatsapp IMO: 008613691605420, Skype: flasonsmt, Email: sales@flason-smt.com

FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !