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  • Canon Anelva Atomic Diffusion Bonding Equipment  BC7000
Canon Anelva Atomic Diffusion Bonding Equipment  BC7000

Canon Anelva Atomic Diffusion Bonding Equipment BC7000

  • Substrate: φ100mm, φ150mm
  • Electric power: 3φ AC200V±10% 125A 50/60Hz
  • Weight: 3720kg (Main body)
  • Product description: Canon Anelva Atomic Diffusion Bonding Equipment BC7000, Substrate: φ100mm, φ150mm, Electric power: 3φ AC200V±10% 125A 50/60Hz, Weight: 3720kg (Main body)
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Canon Anelva Atomic Diffusion Bonding Equipment  BC7000

Specifications:


Equipment for Electronic Device Manufacturing and for R&D
Creating the future with room-temperature bonding
BC7000 Atomic Diffusion Bonding equipment is based on Canon ANELVA's long experience with ultra high vacuum and thin film deposition technologies.
This equipment offers ultra high vacuum in-situ processes of wafer transfer, film deposition, bonding and bonded wafer collection with automatic operation.
It is capable of handling 4inch and 6inch wafers. Mirror polished wafers of any materials can be bonded at room temperature without pressure by optimization of metal and thickness of deposited film at bonding interface.

Features
Bonding at room-temperature
It is not required to heat up due to using atomic diffusion.
No pressure during bonding
It is not required to pressurize due to using surface energy.
High bonding strength
It performs high bonding strength, excellent reliability and high endurance due to metal biding.
Bonding of any similar or dissimilar materials
It is available to adapt the low thermal budget device or differential metals with discrepancy of thermal expansion coefficient.
Schematics of Bonding Process
Metal film deposits on the each wafer
Those are contacted each other in-situ of ultla high vacuum
Those can be bonded with atomic diffusion


Applications
Advanced Packaging
Power device
Optical device
LED
RF device
MEMS
Specifications

Substrate:

φ100mm, φ150mm

Main pump:

Turbo Moleculer Pump (TMP)

Electric power:

3φ AC200V±10% 125A 50/60Hz

Cooling water:

30〜34L/min 0.2〜0.3MPa 15〜30℃

Compressed air:

0.5〜0.8MPa

Process Gas:

0.15〜0.4MPa

Throughput:

3.5min/set (It varies according to a process condition)

Weight:

3720kg (Main body)

Footprint:

W3300mm×D5100mm (standard specification)

Keywords:

Semiconductor silicon wafer production equipments, Wafer Fabricaton/12in, Wafer Fabricaton/8in, Wafer Fabricaton/6in Equipment, Wafer Fabricaton/Under 4in Equipment, Wafer Manufactureing Equipment, ASSY/TEST Equipment, Electrical parts equipmentAnlysis/Measurement equipmentSemiconductor production Common equipment.

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FAQ

1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

5)Why choose us ?

A. Gold supplier on Alibaba !

B. Trade assurance to US$54,000 !

C. Best price & Best shipping & Best service !